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OverviewFull Product DetailsAuthor: Tae-Kyu Lee , Thomas R. Bieler , Choong-Un Kim , Hongtao MaPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: Softcover reprint of the original 1st ed. 2015 Weight: 0.559kg ISBN: 9781489978011ISBN 10: 1489978011 Pages: 253 Publication Date: 01 October 2016 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsReviewsFrom the book reviews: The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners. (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015) From the book reviews: The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners. (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015) Author InformationTab Content 6Author Website:Countries AvailableAll regions |
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