Overview

Fine pitch technology (FPT) is an assembly technology for dealing with high lead count integrated circuits that have been increasing in importance as lead counts have continued to grow. This guide to the subject emphasizes problem-solving and the quality implementation of FPT, detailing the pros, cons, and practicality of various FPT processes and automation methods from the viewpoint of an experienced practitioner. The costs and feasibility of all major methods are explored, and proper design guidelines for manufacturability, testability and reliability are fully detailed. Since FPT packages require higher precision and accuracy than may be available with current CAD systems, guidelines are included on how to achieve necessary design accuracy on less-than-perfect systems. Coverage of the automation (CAD/CAM/CIM) requirements of FPT is included.

Full Product Details

Author:   Phil Marcoux
Publisher:   Van Nostrand Reinhold Inc.,U.S.
Imprint:   Van Nostrand Reinhold Inc.,U.S.
Edition:   1992 ed.
Dimensions:   Width: 15.50cm , Height: 2.00cm , Length: 23.50cm
Weight:   1.490kg
ISBN:  

9780442008628

ISBN 10:   0442008627
Pages:   340
Publication Date:   31 July 1992
Audience:   Professional and scholarly ,  General/trade ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

1 Introduction to Fine Pitch Technology (FPT).- 1.0 Introduction.- 1.1 What is Fpt?.- 1.2 The Benefits of Fine Pitch Technology.- 1.3 The Motivation for Fine Pitch Technology.- 1.4 Comparison of Fpt with Through-Hole and Surfacemount Technologies.- 1.5 Fine Pitch Technology Obstacles and Issues.- 2 The Family of FPT Packages.- 2.0 The Evolution of Fpt Packages.- 2.1 Introduction and Construction of Fine Pitch Packages.- 2.2 Quad Flat Packages.- 2.3 Plastic Quad Flat Packages.- 2.4 Small Outline Packages.- 2.5 Tape Automated Bonded and Guard Ring Packages.- 2.6 Package Handling and Shipping.- 2.7 Package Reliability and Quality.- 2.8 Issues When Selecting an Fpt Package.- 3 Fine Pitch Product Applications.- 3.0 Applications.- 3.1 Product Applications.- 3.2 Package Usage.- 4 Printed Circuit Boards for Fine Pitch Technology.- 4.0 Basic Pcb Processing.- 4.1 Material Options and Properties.- 4.2 Fabrication and Assembly Issues.- 4.3 Composite Electrical Properties.- 4.4 Composite Thermal Properties.- 5 Solder and Application Methods.- 5.0 Solder.- 5.1 Solder Alloy Choices.- 5.2 Flux.- 5.3 Solvents and Thixotropes.- 5.4 Specifying a Paste.- 5.5 Storage.- 5.6 Paste Quality Control and Testing.- 5.7 Applying Solder Paste.- 6 Package Placement.- 6.0 Placement.- 6.1 Placement Options.- 6.2 Additional Placement System Features.- 6.3 Throughput Requirements.- 7 Solder Reflow.- 7.0 Reflow Defined.- 7.1 The Dynamics of the Reflow Process.- 7.2 The Heat Source.- 7.3 Selecting a Reflow Method.- 7.4 Changing Component Location During Reflow.- 8 Post Reflow Cleaning.- 8.1 Successful No-Clean.- 9 Inspection, Rework, and Repair.- 9.0 Inspection.- 9.1 Rework and Repair.- 10 Design for Reliability Guidelines.- 10.1 Defining Solder Joint Reliability.- 10.3 Cause of Solder Joint Fatigue.- 10.4Solder Joint Prediction Models.- 10.5 Electronic Product Use Conditions.- 10.6 General Design for Reliability Guidelines.- 11 Design for Testability.- 11.0 Basics of Electrical Testing Pcas.- 11.1 Contacting the Assembly.- 11.2 Disadvantages of In-Circuit Testing.- 11.3 Alternatives to In-Circuit Testing.- 11.4 Successfully Using Ict For Fpt Testing.- 12 Design for Manufacturability.- 12.0 General Dfm Guidelines.- 12.1 The Rules of Dfm.- 12.2 Implementing Dfm.- 12.3 Dfm Summary.- 13 Specific Design Guidelines for FPT Packages.- 13.1 Package Selection.- 13.2 Package Placement on the Board.- 13.3 Land Pattern Size.- 13.4 Trace Routing and Protection.- 13.5 Thermal Management.- 13.6 Fabrication of the Board.- 13.7 Stencil Fabrication.- Appendix A Addresses of Standards Organizations.- Appendix B Summary of SMT Semiconductor Outlines from JEDEC Publication 95.- Appendix C Summary of Important Component, Material,Process and Design Standards.

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