Failure Analysis of Integrated Circuits: Tools and Techniques

Author:   Lawrence C. Wagner
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 1999
Volume:   494
ISBN:  

9781461372318


Pages:   255
Publication Date:   09 November 2012
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Failure Analysis of Integrated Circuits: Tools and Techniques


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Overview

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

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