Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
Author:   Avram Bar-cohen (Univ Of Maryland, Usa) ,  Jeffrey C Suhling (Auburn Uni, Usa) ,  Andrew A O Tay (S'pore Univ Of Technology & Design;, S'pore)
Publisher:   World Scientific Publishing Co Pte Ltd
ISBN:  

9789811201110


Pages:   1080
Publication Date:   18 October 2019
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)


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Author:   Avram Bar-cohen (Univ Of Maryland, Usa) ,  Jeffrey C Suhling (Auburn Uni, Usa) ,  Andrew A O Tay (S'pore Univ Of Technology & Design;, S'pore)
Publisher:   World Scientific Publishing Co Pte Ltd
Imprint:   World Scientific Publishing Co Pte Ltd
ISBN:  

9789811201110


ISBN 10:   9811201110
Pages:   1080
Publication Date:   18 October 2019
Audience:   College/higher education ,  Professional and scholarly ,  Tertiary & Higher Education ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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