Embedded Artificial Intelligence: Principles, Platforms and Practices

Author:   Bin Li
Publisher:   Springer Verlag, Singapore
Edition:   2024 ed.
ISBN:  

9789819750375


Pages:   260
Publication Date:   07 September 2024
Format:   Paperback
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon its release.

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Embedded Artificial Intelligence: Principles, Platforms and Practices


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Overview

This book focuses on the emerging topic of embedded artificial intelligence and provides a systematic summary of its principles, platforms, and practices. In the section on principles, it analyzes three main approaches for implementing embedded artificial intelligence: cloud computing mode, local mode, and local-cloud collaborative mode. The book identifies five essential components for implementing embedded artificial intelligence: embedded AI accelerator chips, lightweight neural network algorithms, model compression techniques, compiler optimization techniques, and multi-level cascaded application frameworks. The platform section introduces mainstream embedded AI accelerator chips and software frameworks currently used in the industry. The practical part outlines the development process of embedded artificial intelligence and showcases real-world application examples with accompanying code. As a comprehensive guide to the emerging field of embedded artificial intelligence, the book offers rich and in-depth content, a clear and logical structure, and a balanced approach to both theoretical analysis and practical applications. It provides significant reference value and can serve as an introductory and reference guide for researchers, scholars, students, engineers, and professionals interested in studying and implementing embedded artificial intelligence.

Full Product Details

Author:   Bin Li
Publisher:   Springer Verlag, Singapore
Imprint:   Springer Nature
Edition:   2024 ed.
ISBN:  

9789819750375


ISBN 10:   9819750377
Pages:   260
Publication Date:   07 September 2024
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Not yet available   Availability explained
This item is yet to be released. You can pre-order this item and we will dispatch it to you upon its release.

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Bin Li held chief technical positions in several Fortune 500 companies, and he earned a Master’s degree in pattern recognition and artificial intelligence from Beijing Institute of Technology. His research areas include artificial intelligence, distributed computing, and data communication. He is the first inventor of over 20 Chinese and international invention patents.

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