Electronic Product Design for Automated Manufacturing

Author:   Richard Stillwell
Publisher:   Taylor & Francis Inc
Volume:   52
ISBN:  

9780824779375


Pages:   376
Publication Date:   03 October 1988
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Electronic Product Design for Automated Manufacturing


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Overview

Analyzes all phases of the electronic product design process, including management, planning, quality control, design, manufacturing, and automation. A reference/textbook for students and professionals in such fields as electronics, manufacturing, circuit design, computer science. Annotation copyrig

Full Product Details

Author:   Richard Stillwell
Publisher:   Taylor & Francis Inc
Imprint:   Routledge
Volume:   52
Dimensions:   Width: 15.60cm , Height: 2.30cm , Length: 23.40cm
Weight:   0.680kg
ISBN:  

9780824779375


ISBN 10:   0824779371
Pages:   376
Publication Date:   03 October 1988
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Preface, 1: INTRODUCTION, 2: ELECTRONIC PRODUCT DESIGN AND LAUNCH PROCESS, 3: PRODUCT DESIGN BY PLAN, 4: ELECTRONIC PRODUCT DESIGN MANAGEMENT, 5: THE ELECTRONIC PRODUCT DESIGN PROCESS, 6: DESIGN CRITERIA THESIS, 7: DESIGN CONSIDERATIONS AND GUIDELINES FOR AUTOMATIC INSERTION OF COMPONENTS, 8: DESIGN GUIDELINES FOR DUAL IN-LINE PACKAGE COMPONENTS, 9: DESIGN GUIDELINES FOR AXIAL LEAD COMPONENTS, 10: SURFACE-MOUNT TECHNOLOGY NOTEBOOK, 11: A BASIC GUIDE TO SURFACE MOUNTING OF ELECTRONIC COMPONENTS, 12: SURFACE-MOUNTING TECHNOLOGY, Appendix A: Capital Expenditure Procedure, Appendix B: Product Engineering Vendor Survey, Appendix C: Electronic Packaging in Japan, Index

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