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OverviewWith the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayÕs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing. Full Product DetailsAuthor: Stephen Konsowski , Arden HellandPublisher: McGraw-Hill Education - Europe Imprint: McGraw-Hill Professional Dimensions: Width: 15.80cm , Height: 3.50cm , Length: 23.10cm Weight: 0.757kg ISBN: 9780070359703ISBN 10: 0070359709 Pages: 345 Publication Date: 16 July 1997 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Out of Print Availability: Out of stock  Table of ContentsHigh Speed Digital and Microwave Packaging. Fundamentals of Electricity and Magnetism Applied to Electromagnetics. Packaging Technologies for High Speed Digital and Microwave Circuits. Practical Design Details for Microwave Circuit Packaging. Microwave Circuit Assembly and Development. Transmission Lines: Effects and Analysis. Ideal Transmission Lines. Transmission-Line Interconnections: Load and Ends. Signal Reflections, Bandwidth, and Losses. Transmission Lines: Reflection Diagrams. Transmission Lines: Signal Levels. Interconnections: Routing to Critical Signals. ECL Transmission Lines and Terminations. Differential Line Drivers and Terminations.ReviewsAuthor InformationStephen G. Konsowski has 34 years of electronic packaging engineering experience. Retired from Westinghouse as an an advisory engineer, he is now associated with Technology Seminars, Inc. of Lutherville, Maryland. He is a founding member of the Intenrational Electronics Packaging Society (IEPS) and one of its former directors. Mr. Konsowski has authored many technical papers and articles on electronic packaging, including a chapter for the Second Edition of McGraw-Hill's Handbook of Electronic Materials and Processes and Handbook of Packaging and Interconnection. Arden R. Helland is an advisory engineer at the Northrop Grumman Corporation's Electronic Sensors and Systems Division with over 35 years of experience in all phases of electrical design for advanced electronic systems. He is the author of the chapter on the reliability digital systems for the McGraw-Hill Computer Engineering Handbook. Tab Content 6Author Website:Countries AvailableAll regions |
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