Overview

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The text embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. Also, the text provides a useful entry to the literature, with lists of more than 800 references covering a range of subject matter. It should have a valuable role as a source of information and ideas for research and development workers, practical nutritionists, for those engaged in education, extension and consultancy and for interested students.

Full Product Details

Author:   R.R. Tummala ,  Marija Kosec ,  W.K. Jones ,  Darko Belavic
Publisher:   Springer
Imprint:   Springer
Edition:   1998 ed.
Volume:   57
Dimensions:   Width: 15.50cm , Height: 1.90cm , Length: 23.50cm
Weight:   1.360kg
ISBN:  

9780792352181

ISBN 10:   0792352181
Pages:   296
Publication Date:   29 February 2000
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of print, replaced by POD  
We will order this item for you from a manufatured on demand supplier.

Table of Contents

Preface. Performance Predictions. Possibilities of Thermal Resonance in Microcircuits; G. De Mey. Signal Integrity Analysis in Cost Sensitive Interconnections; P. Svasta, et al. The Use of Nonlinearity Measurements for the Reliability Assessment; P.J. Mach. Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure; E. Suhir. The Impact of Stress on the Noise, Quality and Reliability of Passive and Active Devices; J. Sikula, P. Vasina. Process and Materials Development. Smart Unit for Technological Monitoring in Electrochemical Industry; R. Ionescu, et al. Lower Patterning of Printed Wiring Boards for MCM-Ls; ZS. Illyefalvi-Vitez, et al. Silver Filled Adhesives-Controlling Rheology and Electrical Conductivity; P. Sexton, et al. Silicides Formation in Metal-Silicon Film Systems: The Role of Impurities; Yu. Makogon, S.I. Sidorenko. Mechanical properties of Pb-Sn-In-Ag Solders from -100 C to 150 C; W.K. Jones, et al. MCM-D/L. The Need for Low Cost, High Density Packaging and Interconnect Technology; P. Garrou. Application of Electroconducting Polymers in Low Cost Devices; G. Harsanyi, et al. Photosensitive Polymer Thick Films; S. Achmatowicz, et al. Characteristics of Passive Ta-Resistive Planes Embedded in Al-Sheet 'PCB'-Compatible for Integrated MCM-Substrates or Packaging Carriers; P. Philippov. MCM-C. Use of Gravure Offset Printing in Manufacturing of Electronic Applications; S.J. Leppavuori, A.K. Uusimaki. Investigation of Thick Film Resistors for a Multilayer System; M. Hrovat, et al. Reliability Aspects of the Batch Production Based on PTF Technology; M. Somora, et al. A Five Layer Thin Film MCM-Si Design Using Oxynitride Dielectrics; J. Lernout, et al. Packaging Applications. An ASIC View of Low Cost Packaging; P.R. Van Loan. Packaging Technologies for Thick Film Sensors; D. Belavic, et al. Radiation Hardened ASIC Design for Space Applications; J. Trontelj, L. Trontelj. Low Cost Packaging Encoder Circuits; S. Amon, et al. Microwave Filters Manufactured by Advanced Thick-Film Techniques and Novel Silver Pastes; M. Ciez, et al. Systems Level Packaging. System Reliability; N. Sinnadurai. Capabilities and Limitations in Microelectronic Packaging and Assembly within the FSU; S. Muckett. MCM-L in IBM Technology Overview; G. Vendramin. Applications of the Interconnected Mesh Power System (IMPS) Substrate Layer Reduction Topology; L.W. Schaper. Flip Chip and BGA Assembly. Plastic Ball Grid Array (PBGA): A Rising Package Solution; K. Kurzweil, et al. Low Cost Flip Chip on Glass Epoxy FR4 Substrates for Personal Electronics; N. Van Veen. Chip Stacking using Flip Chip Technologies; M. Amskov. Flip Chip Joining Technology Applications; J. Vahakangas, et al. Novel Underfills: Effect of the Filler for Fast-Flow Underfills and Latent Catalyst for No-Flow Underfills on the Processing of Flip Chip Devices; C.P. Wong, et al. Author Index. Keyword Index.

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