Overview

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESSElectronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill. Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into: * Chips * Boards * Solders * Packages * Interconnections * Substrates * Deposition * Cleaning * Coating * The latest environmental rules and constraints ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.

Full Product Details

Author:   Charles Harper
Publisher:   McGraw-Hill Education - Europe
Imprint:   McGraw-Hill Professional
Dimensions:   Width: 15.80cm , Height: 5.30cm , Length: 23.10cm
Weight:   1.066kg
ISBN:  

9780071378826

ISBN 10:   0071378820
Pages:   672
Publication Date:   16 April 2002
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Unknown
Availability:   Awaiting stock  

Table of Contents

Preface Contributors Dedication Chapter 1: Printed Circuit History and Overview Chapter 2: Development and Fabrication of IC Chips Chapter 3: Packaging of IC Chips Chapter 4: Laminates and Prepregs as Circuit Board Base Materials Chapter 5: Printed Circuit Board Fabrication Chapter 6: Package and Component Attachment and Interconnection Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication Chapter 8: Printed Wiring Board Cleaning Chapter 9: Board Coating Materials and Processes Chapter 10: Flexible and Rigid Flexible Fabrication Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites Chapter 12: Hybrid Microelectronics and Multichip Module Technologies Chapter 13: Environmental Considerations in Electronic Assembly Fabrication Index About the Editor

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Author Information

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

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