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OverviewIntegrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. Full Product DetailsAuthor: Cher Ming Tan , Feifei HePublisher: Springer Verlag, Singapore Imprint: Springer Verlag, Singapore Edition: 2013 ed. Dimensions: Width: 15.50cm , Height: 0.60cm , Length: 23.50cm Weight: 1.883kg ISBN: 9789814451208ISBN 10: 9814451207 Pages: 103 Publication Date: 04 May 2013 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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