Overview

Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained.The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.

Full Product Details

Author:   Cher Ming Tan (Ntu, S'pore) ,  Arijit Roy
Publisher:   World Scientific Publishing Co Pte Ltd
Imprint:   World Scientific Publishing Co Pte Ltd
Volume:   0
Dimensions:   Width: 15.50cm , Height: 2.30cm , Length: 22.90cm
Weight:   0.590kg
ISBN:  

9789814273329

ISBN 10:   9814273325
Pages:   312
Publication Date:   25 August 2010
Audience:   College/higher education ,  Professional and scholarly ,  Tertiary & Higher Education ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock  
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

Properties of Metals Used in ULSI Interconnections; Interconnection Reliability Modeling; ULSI Interconnect System and Its Evolution; Theoretical Study of EM; Numerical Study of EM; Experimental Study of EM for Al; Experimental Study of EM for Cu; Factors Affecting EM; Future Challenges of ULSI Interconnections.

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