Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling

Author:   W Sha (Materials science; Metallurgy: Queen’s University Belfast) ,  Xiaomin Wu (Materials innovation institute, Delft, The Netherlands) ,  K G Keong (formerly Queen's University Belfast, UK)
Publisher:   Elsevier Science & Technology
ISBN:  

9780081014974


Pages:   304
Publication Date:   19 August 2016
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling


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Author:   W Sha (Materials science; Metallurgy: Queen’s University Belfast) ,  Xiaomin Wu (Materials innovation institute, Delft, The Netherlands) ,  K G Keong (formerly Queen's University Belfast, UK)
Publisher:   Elsevier Science & Technology
Imprint:   Woodhead Publishing Ltd
Dimensions:   Width: 15.60cm , Height: 1.60cm , Length: 23.40cm
Weight:   0.430kg
ISBN:  

9780081014974


ISBN 10:   008101497
Pages:   304
Publication Date:   19 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

1. Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions Part I: Electroless copper depositions 2. Surface morphology evolution of electroless copper deposits 3. Cross-section of electroless copper deposits and the void fraction 4. Crystal structure and surface residual stress of electroless copper deposits 5. The atomic model of the diamond pyramid structure in electroless copper deposits 6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits 7. Adhesion strength of electroless copper deposit to epoxy board 8. Electrical resistivity of electroless copper deposit 9. Applications of electroless copper deposits Part II: Electroless nickel–phosphorus (Ni–P) depositions 10. Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content 11. Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content 12. Modelling the thermodynamics and kinetics of crystallisation of nickel–phosphorus (Ni–P) deposits 13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits 14. Hardness evolution of nickel–phosphorus (Ni–P) deposits with thermal processing 15. Applications of electroless nickel–phosphorus (Ni–P) plating

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The author's use of modelling brings a new level of fundamental understanding to the field., Materials World


Author Information

Professor Wei Sha is Professor of Materials Science at The Queen’s University of Belfast, UK Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

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