Overview

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating. Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

Full Product Details

Author:   W Sha (Materials science; Metallurgy: Queen’s University Belfast) ,  Xiaomin Wu (Materials innovation institute, Delft, The Netherlands) ,  K G Keong (formerly Queen's University Belfast, UK)
Publisher:   Elsevier Science & Technology
Imprint:   Woodhead Publishing Ltd
Volume:   38
Dimensions:   Width: 15.60cm , Height: 2.70cm , Length: 23.40cm
Weight:   0.610kg
ISBN:  

9781845698089

ISBN 10:   1845698088
Pages:   304
Publication Date:   01 January 2011
Audience:   College/higher education ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   No Longer Our Product
Availability:   In Print  
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Table of Contents

1. Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions Part I: Electroless copper depositions2. Surface morphology evolution of electroless copper deposits3. Cross-section of electroless copper deposits and the void fraction4. Crystal structure and surface residual stress of electroless copper deposits5. The atomic model of the diamond pyramid structure in electroless copper deposits6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits7. Adhesion strength of electroless copper deposit to epoxy board8. Electrical resistivity of electroless copper deposit9. Applications of electroless copper deposits Part II: Electroless nickel–phosphorus (Ni–P) depositions10. Crystallisation of nickel–phosphorus (Ni–P) deposits with high phosphorus content11. Crystallisation of nickel–phosphorus (Ni–P) deposits with medium and low phosphorus content12. Modelling the thermodynamics and kinetics of crystallisation of nickel–phosphorus (Ni–P) deposits13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel–phosphorus deposits14. Hardness evolution of nickel–phosphorus (Ni–P) deposits with thermal processing15. Applications of electroless nickel–phosphorus (Ni–P) plating

Reviews

The authors mention that the book aims to bridge the gap from the last book written on this area in 1991 to the current status. In this they truly meet expectations, and the research monograph style provides enough content to guide any new researcher away from pitfalls while pointing out areas of research. <br>-Kim S. Siow, MIMMM<br>Materials World Magazine, August 4, 2012

The author's use of modelling brings a new level of fundamental understanding to the field., Materials World

Author Information

Professor Wei Sha is Professor of Materials Science at The Queen's University of Belfast, UK. Professor Xin Wu is Associate Professor in the Department of Mechanical Engineering at Wayne State University, USA. Both editors are widely regarded for their research expertise in sheet metal and tailor welded blank forming, behaviour, processing and manufacturing. Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

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