Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author:   Brandon Noia ,  Krishnendu Chakrabarty
Publisher:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2014
ISBN:  

9783319345345


Pages:   245
Publication Date:   23 August 2016
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs


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Author:   Brandon Noia ,  Krishnendu Chakrabarty
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2014
Weight:   4.524kg
ISBN:  

9783319345345


ISBN 10:   3319345346
Pages:   245
Publication Date:   23 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.

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