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OverviewThis book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package. Full Product DetailsAuthor: Artur BalasinskiPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2014 ed. Dimensions: Width: 15.50cm , Height: 2.10cm , Length: 23.50cm Weight: 6.083kg ISBN: 9781461417606ISBN 10: 1461417600 Pages: 278 Publication Date: 06 October 2013 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsReviewsAuthor InformationArtur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California. Tab Content 6Author Website:Countries AvailableAll regions |
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