Overview

There are many techniques for analyzing IC fails, but they are scattered over the professional IC test and diagnosis literature, and in various statistics and data mining handbooks. Moreover, many data mining techniques that are standard in other data analysis environments, and that are appropriate for analyzing IC fails, have not yet been employed for that purpose. Data Mining and Diagnosing IC Fails addresses the problem of obtaining maximum information from (functional) integrated circuit fail data about the defects that caused the fails. It starts at the highest level from mere sort codes, and drills down via various data mining techniques to detailed logic diagnosis. The various approaches discussed in this book have a thorough theoretical underpinning, but are geared towards applications on real life fail data and state of the art ICs. This book brings together a large number of analysis techniques that are suitable for IC fail data, but that are not available elsewhere in a single place. Several of the techniques, in fact, have been presented only recently in technical conferences. The purpose of the book is to bring together in one place a large number of analysis, data mining and diagnosis techniques that have proven to be useful in analyzing IC fails. The descriptions of the techniques and analysis routines is sufficiently detailed that professional manufacturing engineers can implement them in their own work environment.

Full Product Details

Author:   Leendert M. Huisman
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 2005
Volume:   31
Dimensions:   Width: 15.50cm , Height: 1.40cm , Length: 23.50cm
Weight:   0.454kg
ISBN:  

9781441937674

ISBN 10:   1441937676
Pages:   250
Publication Date:   08 December 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Introduction.- Statistics.- Yield Statistics.- Area Dependence of the Yield.- Statistics of Embedded Object Fails.- Fail Commonalities.- Spatial Patterns.- Test Coverage and Test Fallout.- Logic Diagnosis.- Slat Based Diagnosis.- Data Collection Requirements.- Appendix A. Distribution of IC Fails.- Appendix B. General Yield Model.- Appendix C. Simplified Center-Satellite Model.- Appendix D. Quadrat Analysis.- Appendix E. Cell Fail Probabilities.- Appendix F. Characterization Group.- Appendix G. Component Fail Probabilities.- Appendix H. Yield and Coverage.- Appendix I. Estimating First Fail Probabilities from the Fallout.- Appendix J. Identity of M and S.- References.- Index.

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