Overview

A complete guide to the state of the art and future direction of copper interconnect technology Owing to its performance advantages, copper metallization for IC interconnect is attracting tremendous interest in the semiconductor community worldwide. This timely book provides scientists and engineers with a much--needed, comprehensive reference on the fundamentals and applications of this emerging technology. The authors draw on more than a decade of intimate involvement with copper interconnect research, integrating the vast amounts of available knowledge and making clear the connection between mechanistic principles and relevant technologies. In--depth, cutting--edge discussions include: The effects of copper in semiconductor materials, especially silicon The fundamental chemistry and electro--chemistry of copper The effects of copper on insulating materials such as glass and polymers Intermetallic and interfacial reactions of copper in layered structures Current and projected applications of copper in integrated circuits Copper--Fundamental Mechanisms for Microelectronic Applications also features extensive references, tables, and over 100 illustrations--including dual Damascene patterning necessary for copper interconnects. It is an excellent resource for anyone seeking to explore the current literature and gain insight into opportunities opening in the field.

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9780471252566

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SHYAM P. MURARKA, PhD, is a professor in the Department of Materials Science and Engineering at the Rensselaer Polytechnic Institute, Troy, New York. IGOR V. VERNER, PhD, is a professor at Moscow Institute of Electronic Technology (MIET) in Russia. RONALD J. GUTMANN, PhD, is a professor in the Department of Electrical, Computer, and Systems Engineering at Rensselaer Polytechnic Institute, Troy, New York.

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