Overview

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Full Product Details

Author:   Madhusudan Iyengar (Google, Usa) ,  Karl J L Geisler (3m, Usa) ,  Bahgat G Sammakia (Suny-binghamton Univ, Usa)
Publisher:   World Scientific Publishing Co Pte Ltd
Imprint:   World Scientific Publishing Co Pte Ltd
Volume:   3
Dimensions:   Width: 15.50cm , Height: 3.00cm , Length: 23.10cm
Weight:   0.798kg
ISBN:  

9789814579780

ISBN 10:   9814579785
Pages:   472
Publication Date:   23 October 2014
Audience:   College/higher education ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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