Overview

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to approaching leading specialists with a request to contribute to the present book. ""Cooling of Electronic Systems"" presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. It starts with an introduction to the cooling of electonic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics are covered. This book on the thermal management of electronic and microelectronic equipment, presented by eminent scientists and experts in the field, should be useful reading for all designers of modern, high-speed computers.

Full Product Details

Author:   Sadik Kakaç ,  Hafit Yüncü ,  K. Hijikata
Publisher:   Springer
Imprint:   Springer
Edition:   1994 ed.
Volume:   258
Weight:   1.790kg
ISBN:  

9780792327363

ISBN 10:   0792327365
Pages:   962
Publication Date:   28 February 1994
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock  
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Table of Contents

to ASI on Cooling of Electronic Systems.- Trends in the Packaging of Computer Systems.- Beyond Thermal Limits in Computer Systems Cooling.- Cooling Technology for High Performance Computers: Design Applications.- Cooling Technology for High Performance Computers: IBM Sponsored University Research.- Natural Convection Cooling of an Array of Heated Plates Simulating Printed Circuit Boards.- Convection in Arrays of Electronic Packages Containing Longitudinal Fin Heat Sinks.- Experiments on Natural Convective Air Cooling of a PCBs Array in a Closed Casing with Inclination.- Cooling of Multiple Heat Sources Attached to Two Dimensional Rectangular Fins.- Natural Convection Heat Transfer from Horizontal Rectangular Fin Arrays.- Cooling of a Microelectronic Sensor by Turbulent Forced Convection.- Computation of Steady Laminar Natural Convective Heat Transfer from Localized Heat.- Unsteady Forced Convection in a Duct with and without Array of Block-Like Electronic Components.- Optimal Geometryof Convection Cooled Electronic Packages.- A Thermal Design Approach for Electronic Equipment by use of a Personal Computer and Flow Visualization.- Experimental Visualization of Temperature Fields and Measurement of Heat Transfer Enhancement in Electronic System Models.- Cooling of Electronic Systems by Impinging Air Jets.- Numerical and Experimental Studies for the Conjugate Direct Cooling of a Micro Heat Generating Element.- The Cooling of Electronic Components with Flat Plate Heat Sinks.- Fundamentals of Nucleate Pool Boiling of Highly-Wetting Dielectric Liquids..- Single-Phase Liquid Jet Impingement Cooling of High-Performance Chips.- Application of Channel Flows to Single-Phase Liquid Cooling of Chips and Multi-Chip Modules.- Immersion Cooling of Digital Computers.- Boiling Coupled with Air Cooling.- Thermal Control for Cryogenically Cooled Computer Systems.- Thermal Contact Conductance-Theory and Applications.- Analysis of Extended Surface Arrays for Air-Cooled Electronic Equipment.- The Choking of Finned Arrays.- Error Analysis and Improved Formulations for Extended Surfaces.- Determination of the Weighted-Average Case Temperature for a Single Chip Package.- Network Modelling of Two-Phase Flow in Porous Structures: An Alternative for the Study of Chip Cooling Enhancement.- Accurate Temperature Prediction in Consumer Electronics: A Must but still a Myth.- Pragmatic Methods for Determining the Parameters Required for the Thermal Analysis of Electronic Systems.- Effective Heat Transfer Coefficients and Temperature Modelling in Electronic Systems.- Information Processing and Heat Transfer Engineering: Some Generic Views on Future Research Needs.- Research Needs in Thermal Management of Electronic Systems.

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