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OverviewThis book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing. The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test. Full Product DetailsAuthor: Selahattin SayilPublisher: Springer International Publishing AG Imprint: Springer International Publishing AG Edition: 1st ed. 2018 Weight: 0.454kg ISBN: 9783319696720ISBN 10: 3319696726 Pages: 93 Publication Date: 04 December 2017 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of Contents1. Conventional Test Methods. – 2. Testability Design.- 3. Other Techniques Based on the Contacting Probe.- 4. Contactless Testing.- 5. Electron-Beam and Photoemission Probing.- 6. Electro Optic Sampling and Charge Density Probe.- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe.- 8. Probing Techniques Based on Light Emission from Chip.- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits.- 10. Comparison of Contactless Testing Methodologies.ReviewsAuthor InformationDr. Selahattin Sayil is a Professor in the Philip M. Drayer Department of Electrical Engineering at Lamar University. His research focuses on VLSI Testing, Contactless Testing, Radiation effects modeling and hardening at the circuit level, Reliability analysis of low power designs, and Interconnect modeling and noise prediction. Tab Content 6Author Website:Countries AvailableAll regions |
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