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OverviewThis text covers activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modelling), tradeoff analysis, partitioning and decision process capture. ll of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. This work lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability and testing. It should be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis. Full Product DetailsAuthor: Peter A. Sandborn , Hector MorenoPublisher: Springer Imprint: Springer Edition: 1993 ed. Volume: 250 Dimensions: Width: 15.50cm , Height: 1.70cm , Length: 23.50cm Weight: 1.260kg ISBN: 9780792393955ISBN 10: 0792393953 Pages: 260 Publication Date: 31 October 1993 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents1 Introduction.- 2 Information Modeling and Representation.- 3 Tradeoff Analysis.- 4 Design Partitioning.- 5 Tradeoff Analyses for Multichip Systems.- List of Symbols.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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