Conceptual Design of Multichip Modules and Systems

Author:   Peter A. Sandborn ,  Hector Moreno
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 1993
Volume:   250
ISBN:  

9781441951373


Pages:   260
Publication Date:   07 December 2010
Format:   Paperback
Availability:   Awaiting stock   Availability explained
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Conceptual Design of Multichip Modules and Systems


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Overview

Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.

Full Product Details

Author:   Peter A. Sandborn ,  Hector Moreno
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 1993
Volume:   250
Dimensions:   Width: 21.00cm , Height: 1.40cm , Length: 27.90cm
Weight:   0.695kg
ISBN:  

9781441951373


ISBN 10:   1441951377
Pages:   260
Publication Date:   07 December 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Awaiting stock   Availability explained
The supplier is currently out of stock of this item. It will be ordered for you and placed on backorder. Once it does come back in stock, we will ship it out for you.

Table of Contents

1 Introduction.- 2 Information Modeling and Representation.- 3 Tradeoff Analysis.- 4 Design Partitioning.- 5 Tradeoff Analyses for Multichip Systems.- List of Symbols.

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