Overview

Full Product Details

Author:   Bernd Hoefflinger
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint:   Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Edition:   2012
Dimensions:   Width: 15.50cm , Height: 2.50cm , Length: 23.50cm
Weight:   1.014kg
ISBN:  

9783642223990

ISBN 10:   3642223990
Pages:   477
Publication Date:   19 January 2012
Audience:   Professional and scholarly ,  College/higher education ,  Professional & Vocational ,  Undergraduate
Format:   Hardback
Publisher's Status:   Active
Availability:   Awaiting stock  
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Table of Contents

Introduction: Towards Sustainable 2020 Nanoelectronics.- From Microelectronics to Nanoelectronics.- The Future of Eight Chip Technologies.- Analog–Digital Interfaces.- Interconnects and Transceivers.- Requirements and Markets for Nanoelectronics.- ITRS: The International Technology Roadmap for Semiconductors.- Nanolithography.- Power-Efficient Design Challenges.- Superprocessors and Supercomputers.- Towards Terabit Memories.- 3D Integration for Wireless Multimedia.- The Next-Generation Mobile User-Experience.- MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer.- Vision Sensors and Cameras.- Digital Neural Networks for New Media.- Retinal Implants for Blind Patients.- Silicon Brains.- Energy Harvesting and Chip Autonomy.- The Energy Crisis.- The Extreme-Technology Industry.- Education and Research for the Age of Nanoelectronics.- 2020 World with Chips.

Reviews

From the reviews: The book's chapters provides an almost definitive list of hot topics and includes chapters on logic and computing, analog-digital interfaces, interconnects and transceivers ! power efficient design and energy harvesting and chip autonomy. ! It is suitable both for the student, researcher or recent graduate that wants to understand where the challenges lie in chips, and for experienced managers, investors and policy makers, who may have been looking at the trees for so long that they will now benefit from this look at the forest. (Peter Clarke, EETimes, February, 2012)

Author Information

About the Editor Prof. Hoefflinger has a lifelong career with semiconductor chips: After starting at Siemens Research, he was invited to join the faculty at Cornell University, where he set up and taught the first graduate course on integrated circuits (IC’s). He continued as the first product manager for MOS IC’s, Siemens, Munich. With that experience, he became a co-founder of the University of Dortmund, where he built the first public pilot line for IC’s in Europe, which realized the world’s first all-ion-implanted Bipolar-CMOS process. As Head of the Electrical Engineering Departments at the University of Minnesota and at Purdue University, he led the major expansions of their electronics programs. He was invited back to Germany to build and lead the Institute for Microelectronics Stuttgart. As a public enterprise for contract R&D, it became one of the first certified manufacturing lines in Europe for CMOS Application-Specific Circuits. It has become the world leader in the development and manufacture of test masks for every next-generation lithography since the 1990’s. Bernd Hoefflinger has been the recipient or co-recipient of numerous scientific and best-product awards. He is a member of the Dusseldorf Academy of Sciences

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