Overview

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Full Product Details

Author:   John H. Lau
Publisher:   Van Nostrand Reinhold Inc.,U.S.
Imprint:   Van Nostrand Reinhold Inc.,U.S.
Edition:   1994 ed.
Dimensions:   Width: 15.50cm , Height: 3.10cm , Length: 23.50cm
Weight:   2.170kg
ISBN:  

9780442014414

ISBN 10:   0442014414
Pages:   556
Publication Date:   30 June 1994
Audience:   College/higher education ,  General/trade ,  Undergraduate ,  General
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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