Free Delivery Over $100
|
|
|||
|
||||
OverviewFull Product DetailsAuthor: John E.J. Schmitz (Philips Semiconductor; former COO of SEMATECH)Publisher: William Andrew Publishing Imprint: William Andrew Publishing Dimensions: Width: 15.20cm , Height: 1.50cm , Length: 22.90cm Weight: 0.470kg ISBN: 9780815512882ISBN 10: 0815512880 Pages: 251 Publication Date: 31 December 1992 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Out of Print Availability: Out of print, replaced by POD  We will order this item for you from a manufatured on demand supplier. Table of ContentsIntroduction The Blanket Tungsten Approach The Selective Tungsten Approach Blanket Versus Selective Tungsten Tungsten as Interconnect Material The Chemistry of CVD-W and Properties of Tungsten The Deposition Equipment Miscellaneous Chemical Vapor Deposition of Tungsten Silicide References Author Index Subject Index Appendix: Unit Cells of W and WSi2Reviews"""After reading this book, an engineer should have all the necessary background."" --European Semiconductor" """After reading this book, an engineer should have all the necessary background."" - European Semiconductor" After reading this book, an engineer should have all the necessary background. - European Semiconductor Author InformationTab Content 6Author Website:Countries AvailableAll regions |
||||
