Boundary-Scan Interconnect Diagnosis

Author:   José T. de Sousa ,  Peter Y.K. Cheung
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2001
Volume:   18
ISBN:  

9781441948878


Pages:   168
Publication Date:   07 December 2010
Format:   Paperback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Boundary-Scan Interconnect Diagnosis


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Overview

Boundary-Scan Interconnect Diagnosis explains how to synthesize digital diagnostic sequences for wire interconnects using boundary-scan, and how to assess the quality of those sequences. Its importance has to do with designing complex electronic systems using pre-designed intellectual property (IP) cores, which is becoming increasingly popular nowadays. Since tests for pre-designed cores can be supplied with the cores themselves, the only additional tests that need to be developed to test and diagnose the entire system are those for wire interconnects between the cores. Besides the trivial solutions that are often used to solve this problem, there are many more methods that enable significant optimizations of test vector length and/or diagnostic resolution. The book surveys all existing methods of this kind and proposes new ones. In the new approach circuit and interconnect faults are carefully modeled, and graph techniques are applied to solve the problem. The original feature of the new method is the fact that it can be adjusted to provide shorter test sequences and/or greater diagnostic resolution. The effectiveness of existing and proposed methods is then evaluated using real electronic assemblies and published statistical data for an actual manufacturing process from HP.

Full Product Details

Author:   José T. de Sousa ,  Peter Y.K. Cheung
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2001
Volume:   18
Dimensions:   Width: 15.50cm , Height: 1.00cm , Length: 23.50cm
Weight:   0.454kg
ISBN:  

9781441948878


ISBN 10:   1441948872
Pages:   168
Publication Date:   07 December 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

Interconnect Circuit and Fault Models.- Behavioral Interconnect Diagnosis.- Structural Interconnect Diagnosis.- Diagnostic Resolution Assessment.- Experimental Results.- Conclusion.

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