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OverviewThe author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling. It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields. This presentation of advanced work in bond graph modeling presents the leading edge of research in this field. It is hoped that it stimulates new ideas with regard to further progress in theory and in applications. Full Product DetailsAuthor: Wolfgang BorutzkyPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2011 Dimensions: Width: 15.50cm , Height: 2.50cm , Length: 23.50cm Weight: 0.835kg ISBN: 9781441993670ISBN 10: 1441993673 Pages: 435 Publication Date: 14 June 2011 Audience: Professional and scholarly , Professional & Vocational Replaced By: 9783319474335 Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |