Free Delivery Over $100
|
|
|||
|
||||
OverviewThis book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering. Full Product DetailsAuthor: Khaled Salah , Yehea Ismail , Alaa El-RoubyPublisher: Springer International Publishing AG Imprint: Springer International Publishing AG Edition: 2015 ed. Dimensions: Width: 15.50cm , Height: 1.30cm , Length: 23.50cm Weight: 4.144kg ISBN: 9783319076102ISBN 10: 3319076108 Pages: 179 Publication Date: 05 September 2014 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsIntroduction: Work around Moore’s Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
||||
