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OverviewFull Product DetailsAuthor: Khaled Salah , Yehea Ismail , Alaa El-RoubyPublisher: Springer International Publishing AG Imprint: Springer International Publishing AG Edition: Softcover reprint of the original 1st ed. 2015 Dimensions: Width: 15.50cm , Height: 1.00cm , Length: 23.50cm Weight: 2.993kg ISBN: 9783319374970ISBN 10: 3319374974 Pages: 179 Publication Date: 23 August 2016 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsIntroduction: Work around Moore’s Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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