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OverviewThis book presents the mechanics of piezoelectric semiconductor structures where the main electromechanical coupling of interest is the interaction between mechanical fields and semiconduction. This volume stands as the first full book treatment of this multi-physical subject from the mechanics angle. The analysis of piezoelectric semiconductor structures and devices is an emerging and rapidly growing interdisciplinary area involving materials, electronics, and solid mechanics. It has direct applications in the new area of piezotronics and piezo-phototronics. The book is theoretical, beginning with a phenomenological framework and progressing to include solutions to problems fundamental to the theory and application. Dr. Yang illustrates how in piezoelectric semiconductors, mechanical fields interact with semiconduction through the piezoelectrically produced electric fields by mechanical loads. This provides the foundation of piezotronic and piezo-phototronic devices in which semiconduction is induced, affected, manipulated, or controlled by mechanical fields. Also discussing composite structures of piezoelectric dielectrics and nonpiezoelectric semiconductors as well as thermal effects, the book is an ideal basic reference on the topic for researchers. Full Product DetailsAuthor: Jiashi YangPublisher: Springer Nature Switzerland AG Imprint: Springer Nature Switzerland AG Edition: 1st ed. 2020 Weight: 0.454kg ISBN: 9783030482084ISBN 10: 3030482081 Pages: 230 Publication Date: 21 June 2021 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand We will order this item for you from a manufactured on demand supplier. Table of ContentsChapter 1. Macroscopic Theory.- Chapter 2. Exact Solutions.- Chapter 3. Extension of Rods.- Chapter 4. Bending of Beams.- Chapter 5. Extension and Bending of Plates.- Chapter 6. Composite Structures.- Chapter 7. Thermal Effects.ReviewsAuthor InformationDr. Jiashi Yang received his B.E. and M.E. in Engineering Mechanics in 1982 and 1985 from Tsinghua University, Beijing, China; M.S. in Mechanical Engineering in 1988 from Syracuse University, USA; and Ph.D. in Civil Engineering in 1993 from Princeton University, USA. He was a Postdoctoral Fellow from 1993 to 1994 at the University of Missouri-Rolla, and from 1994 to 1995 at Rensselaer Polytechnic Institute. He was employed by Motorola, Inc. as an engineer from 1995 to 1997. Since 1997 he has been an Assistant, Associate, and Full Professor at the Department of Mechanical and Materials Engineering of University of Nebraska-Lincoln. His main research area is theoretical and numerical modeling of electromechanical materials, structures, and devices. Tab Content 6Author Website:Countries AvailableAll regions |