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OverviewModern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high-performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge of achieving compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is therefore mandatory for every IC designer. This is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular mechanisms of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Full Product DetailsAuthor: X. Aragones , J.L. Gonzalez , Antonio RubioPublisher: Springer Imprint: Springer Edition: 1999 ed. Dimensions: Width: 15.60cm , Height: 1.50cm , Length: 23.40cm Weight: 1.180kg ISBN: 9780792385042ISBN 10: 0792385047 Pages: 240 Publication Date: 30 April 1999 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents1. Introduction.- 2. Substrate noise characteristics and propagation.- 3. Substrate coupling modeling.- 4. Substrate biasing and noise coupling.- 5. Alternative proposals for reducing substrate noise.- 6. Experimental measurements performed on a mixed-signal IC.- 7. The cause of switching noise.- 8. Digital design for low switching noise.- 9. Techniques and circuits for reducing switching noise.- 10. Conclusions.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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