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OverviewFull Product DetailsAuthor: Beth Keser , Steffen KröhnertPublisher: John Wiley & Sons Inc Imprint: Wiley-IEEE Press Dimensions: Width: 15.80cm , Height: 3.30cm , Length: 23.40cm Weight: 1.021kg ISBN: 9781119314134ISBN 10: 1119314135 Pages: 576 Publication Date: 29 March 2019 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationBeth Keser, Ph.D., is a recognized global leader in the semiconductor industry with over 20 years' experience resulting in 28 patents and patents pending and over 40 publications. She is an IEEE Senior Member whose volunteer activities and professional society responsibilities include: IEEE EPS' VP of Education, 2015 ECTC General Chair, and more. Steffen Kröhnert, M.SC., is Senior Director of Technology Development at Amkor Technology Holding B.V., Germany. He has more than 20 years' experience in the semiconductor industry. Steffen is author and co-author of 23 patent filings in the area of Semiconductor Packaging Technology, and an active member of IEEE EPS, IMAPS, SMTA, VDI, VDE and GPM. Tab Content 6Author Website:Countries AvailableAll regions |
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