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OverviewAdvanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. Full Product DetailsAuthor: Ho-Ming Tong , Yi-Shao Lai , C.P. WongPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: Softcover reprint of the original 1st ed. 2013 Weight: 9.516kg ISBN: 9781489979339ISBN 10: 1489979336 Pages: 560 Publication Date: 23 August 2016 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsFlip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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