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Author:   M O Alam ,  C Bailey (University of Greenwich, UK) ,  Christopher Bailey
Publisher:   Elsevier Science & Technology
Imprint:   Woodhead Publishing Ltd
Dimensions:   Width: 15.60cm , Height: 1.50cm , Length: 23.40cm
Weight:   0.400kg
ISBN:  

9780081017326

ISBN 10:   0081017324
Pages:   280
Publication Date:   19 August 2016
Audience:   Professional and scholarly ,  Professional and scholarly ,  Professional & Vocational ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Contributor contact details Chapter 1: Introduction to adhesives joining technology for electronics Abstract: 1.1 Introduction 1.2 Classification of adhesives used in electronic packaging 1.3 A brief overview of electronic assemblies 1.4 Typical uses of advanced adhesives in electronics Chapter 2: Thermally conductive adhesives in electronics Abstract: 2.1 Introduction 2.2 Model of heat conductance 2.3 Heat transport in thermally conductive adhesives 2.4 Thermally conductive fillers 2.5 Role of polymer base materials 2.6 Thermal conductivity of adhesives and methods for its measurement 2.7 Conclusions Chapter 3: Anisotropic conductive adhesives in electronics Abstract: 3.1 Introduction 3.2 Nature of adhesive bond 3.3 Materials and processing 3.4 Critical loading 3.5 Evaluation methods 3.6 Case studies 3.7 Conclusions 3.8 Acknowledgments 3.10 Appendix: List of abbreviations Chapter 4: Isotropic conductive adhesives in electronics Abstract: 4.1 Introduction 4.2 General isotropic conductive adhesive (ICA) properties 4.3 Reliability 4.4 Modeling 4.5 Nanotechnologies in isotropic conductive adhesives 4.6 Conclusions Chapter 5: Underfill adhesive materials for flip chip applications Abstract: 5.1 Introduction: flip chip and direct chip attachment technology 5.2 Advantages of direct chip attachment technology 5.3 Reliability challenge of flip chip technology 5.4 Advances in the flip chip underfill process and encapsulant materials 5.5 New material challenges to lead-free solder 5.6 The ′no-flow′ pre-applied underfill process 5.7 The wafer level pre-applied underfill process 5.8 The wafer level dual encapsulation process 5.9 Conclusions Chapter 6: Structural integrity of metal–polymer adhesive interfaces in microelectronics Abstract: 6.1 Introduction 6.2 Theoretical considerations of work of fracture and bonding strength of adhesive joints 6.3 Chemical and physical intermolecular interactions at interfaces 6.4 Other influential factors determining bond strength of real adhesive joints 6.5 Effect of environmental factors 6.6 Interconnections using electrically conductive adhesives 6.7 Conclusions Chapter 7: Modelling techniques used to assess conductive adhesive properties Abstract: 7.1 Introduction 7.2 Numerical modelling technologies 7.3 Modelling applied to packaging processes 7.4 Modelling the thermal, electrical and mechanical performance of adhesives 7.5 Future trends 7.6 Conclusions Chapter 8: Adhesive technology for photonics Abstract: 8.1 Introduction 8.2 The major characteristics of adhesives for photonic applications 8.3 Types of adhesive used in photonics 8.4 Major applications of adhesives in photonics 8.5 Adhesives for photonic packaging 8.6 Adhesives used in photonic devices 8.7 Typical challenges for reliable fabrication of photonic devices 8.8 Conclusions Index

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Author Information

M. O. Alam is a Researcher in the School of Computing and Mathematical Sciences at the University of Greenwich, UK. Christopher Bailey is a Professor in the School of Computing and Mathematical Sciences at the University of Greenwich, UK.

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