A Signal Integrity Engineer's Companion: Real-Time Test and Measurement and Design Simulation

Author:   Geoff Lawday ,  David Ireland ,  Greg Edlund ,  Greg Edlund
Publisher:   Pearson Education (US)
ISBN:  

9780131860063


Pages:   496
Publication Date:   09 July 2008
Replaced By:   9780133411270
Format:   Hardback
Availability:   Out of stock   Availability explained


Our Price $290.40 Quantity:  
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A Signal Integrity Engineer's Companion: Real-Time Test and Measurement and Design Simulation


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Overview

A Signal Integrity Engineer’s Companion   Real-Time Test and Measurement and Design Simulation   Geoff Lawday David Ireland Greg Edlund   Foreword by Chris Edwards, Editor, IET Electronics Systems and Software magazine   Prentice Hall Modern Semiconductor Design Series Prentice Hall Signal Integrity Library   Use Real-World Test and Measurement Techniques to Systematically Eliminate Signal Integrity Problems     This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integrity (SI) test and measurement for high-speed digital designs. Three of the field’s leading experts guide you through systematically detecting, observing, analyzing, and rectifying both modern logic signal defects and embedded system malfunctions. The authors cover the entire life cycle of embedded system design from specification and simulation onward, illuminating key techniques and concepts with easy-to-understand illustrations.   Writing for all electrical engineers, signal integrity engineers, and chip designers, the authors show how to use real-time test and measurement to address today’s increasingly difficult interoperability and compliance requirements. They also present detailed, start-to-finish case studies that walk you through commonly encountered design challenges, including ensuring that interfaces consistently operate with positive timing margins without incurring excessive cost; calculating total jitter budgets; and managing complex tradeoffs in high-speed serial interface design.   Coverage includes Understanding the complex signal integrity issues that arise in today’s high-speed designs Learning how eye diagrams, automated compliance tests, and signal analysis measurements can help you identify and solve SI problems Reviewing the electrical characteristics of today’s most widely used CMOS IO circuits Performing signal path analyses based on intuitive Time-Domain Reflectometry (TDR) techniques Achieving more accurate real-time signal measurements and avoiding probe problems and artifacts Utilizing digital oscilloscopes and logic analyzers to make accurate measurements in high-frequency environments Simulating real-world signals that stress digital circuits and expose SI faults Accurately measuring jitter and other RF parameters in wireless applications   About the Authors: Dr. Geoff Lawday is Tektronix Professor in Measurement at Buckinghamshire New University, England. He delivers courses in signal integrity engineering and high performance bus systems at the University Tektronix laboratory, and presents signal integrity seminars throughout Europe on behalf of Tektronix. David Ireland, European and Asian design and manufacturing marketing manager for Tektronix, has more than 30 years of experience in test and measurement. He writes regularly on signal integrity for leading technical journals. Greg Edlund, Senior Engineer, IBM Global Engineering Solutions division, has participated in development and testing for ten high-performance computing platforms. He authored Timing Analysis and Simulation for Signal Integrity Engineers (Prentice Hall).    

Full Product Details

Author:   Geoff Lawday ,  David Ireland ,  Greg Edlund ,  Greg Edlund
Publisher:   Pearson Education (US)
Imprint:   Prentice Hall
Dimensions:   Width: 25.20cm , Height: 3.00cm , Length: 20.30cm
Weight:   0.864kg
ISBN:  

9780131860063


ISBN 10:   0131860062
Pages:   496
Publication Date:   09 July 2008
Audience:   College/higher education ,  Tertiary & Higher Education
Replaced By:   9780133411270
Format:   Hardback
Publisher's Status:   Out of Print
Availability:   Out of stock   Availability explained

Table of Contents

Foreword    xv Preface        xix Acknowledgments xxviii About the Authors xxx 1        Introduction: An Engineer’s Companion       1 2        Chip-to-Chip Timing and Simulation   31 3        Signal Path Analysis as an Aid to Signal Integrity    87 4        DDR2 Case Study 117 5        Real-Time Measurements: Probing      159 6        Testing and Debugging: Oscilloscopes and Logic Analyzers       213 7        Replicating Real-World Signals with Signal Sources         255 8        Signal Analysis and Compliance          287 9        PCI Express Case Study 367 10      The Wireless Signal         399 Index 439  

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Author Information

Dr. Geoffrey Lawday currently holds the Tektronix Chair in Measurement at Buckinghamshire New University where he teaches embedded system design and high performance computing in the School of Computing. Having gained a BSc in Physics and an MSc in Computer Engineering at Surrey University, he was awarded a PhD in Time-Frequency Signal Analysis from Brunel University. His research in signal integrity engineering is reflected in his publications, such as the critique on the introduction of the new serial buses published in the flagship journal of the Institution of Electrical Engineers.   David Ireland has more than thirty years experience in test and measurement ranging from an engineering apprenticeship with Racal, where he gained his formal electronic engineering qualifications, to his current position at Tektronix, where he is the marketing manager of design and manufacturing at Tektronix Europe. He is widely recognized by embedded system engineers in Europe for his signal integrity articles and collaborative workshops on high-speed digital system design, test, and measurement.   Greg Edlund’s career in signal integrity began in 1988 at Supercomputer Systems, Inc., where he simulated and measured timing characteristics of bipolar embedded RAMs used in the computer’s vector registers. Since then, he has participated in the development and testing of nine other high-performance computing platforms for Cray Research, Inc., Digital Equipment Corp., and IBM Corp. He has had the good fortune of learning from many talented engineers while focusing his attention on modeling, simulation, and measurement of IO circuits and interconnect components. A solid physical foundation and practical engineering experience combine to form a valuable perspective on optimizing performance, reliability, and cost.  

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