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OverviewPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology Full Product DetailsAuthor: Banqiu Wu , Ajay Kumar , Sesh RamaswamiPublisher: McGraw-Hill Education - Europe Imprint: McGraw-Hill Professional Dimensions: Width: 16.00cm , Height: 2.30cm , Length: 23.60cm Weight: 0.782kg ISBN: 9780071741958ISBN 10: 007174195 Pages: 544 Publication Date: 16 September 2011 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsChapter 1. Introduction to High-Density Through Silicon Stacking Technology Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack Chapter 4. Process Integration for TSV Manufacturing Chapter 5. High-Aspect-Ratio Silicon Etch for TSV Chapter 6. Dielectric Deposition for Through Silicon Vias Chapter 7. Barrier and Seed Deposition Chapter 8. Copper Electrodeposition for TSV Chapter 9. Chemical Mechanical Polishing for TSV Chapter 10. Temporary and Permanent Bonding Chapter 11. Assembly and Test Aspects of TSV Technology IndexReviewsAuthor InformationBanqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards. Dr. Ajay Kumar is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds more than 100 US patents and has won many awards for innovation and commercialization. Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS. Tab Content 6Author Website:Countries AvailableAll regions |
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