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Overview""3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme""elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. Full Product DetailsAuthor: Yangdong Deng , Wojciech P. MalyPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Edition: 2010 ed. Dimensions: Width: 15.50cm , Height: 1.50cm , Length: 23.50cm Weight: 0.440kg ISBN: 9783642041563ISBN 10: 3642041566 Pages: 200 Publication Date: 21 June 2010 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Awaiting stock  The supplier is currently out of stock of this item. It will be ordered for you and placed on backorder. Once it does come back in stock, we will ship it out for you. Table of ContentsA Cost Comparison of VLSI Integration Schemes.- Design Case Studies.- An Automatic 2.5-D Layout Design Flow.- Floorplanning for 2.5-D Integration.- Placement for 2.5-D Integration.- A Road map of 2.5-D Integration.- Conclusion and Future Work.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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